Heat sink of encapsulation through high frequency in use for semiconductor laser modulated by electrical absorption

用于电吸收调制半导体激光器高频封装的热沉

Abstract

一种用于电吸收调制半导体激光器高频封装的热沉,其中包括:一电介质热沉基片;一微波传输线,该微波传输线制作在电介质热沉基片的上表面的一侧,该微波传输线在电介质热沉基片的上表面形成三个端点;一薄膜电阻,该薄膜电阻制作在电介质热沉基片的上表面,形成在微波传输线的端点的尾端;多条金属电极,该多条金属电极制作在电介质热沉基片的上表面的另一侧;一地电极,该地电极制作在电介质热沉基片的下表面,且将电介质热沉基片的下表面覆盖。
The heat sink includes following parts: a basal piece of dielectric heat sink; being prepared on one side of up surface on the basal piece of dielectric heat sink, a microwave transmission line forms three endpoints on the said up surface; being prepared up surface on the basal piece of dielectric heat sink, a film resistor is formed on tail end of endpoint in microwave transmission line; multiple pieces of metal electrodes are prepared on the other side of up surface on the basal piece of dielectric heat sink; being prepared on the low surface of basal piece of dielectric heat sink, an earthed electrode covers the low surface of basal piece of dielectric heat sink.

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Cited By (6)

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    CN-101527379-BJuly 25, 2012清华大学Microwave feeder unit used for sealing semiconductor electric absorption modulator
    CN-102324964-AJanuary 18, 2012武汉电信器件有限公司Light transmitter with double-open-circuit short-knot matching network
    CN-102833950-ADecember 19, 2012中国电子科技集团公司第二十四研究所提高导热和过流能力的基板制作方法
    CN-104041195-BDecember 21, 2016华为技术有限公司光电子器件
    US-9210802-B2December 08, 2015Huawei Technologies Co., Ltd.Optoelectronic device packaging method and chip assembly having an isolation dielectric located on both sides of a high-frequency transmission line to form a coplanar waveguide transmission line
    WO-2014059632-A1April 24, 2014华为技术有限公司光电子器件